HCT耐电流电阻测试仪 PCB板测试

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PCB板高电流测试仪

一、简介
High Density Interconnections--高密度互联技术 HDI
HDI 板是指通过高密度微细布线和微小导通孔技术来生产制作的线路板，是 PCB 行业在 20 世纪末发展起来的一门较新的技术，与传统 PCB 相比采用激光钻孔技术（又称镭射板），钻孔更小，线路更窄，焊盘大幅度减小，所有单位面积内可以得到更多的线路分布，高密度互连由此而来，HDI 技术的出现，适应幵推进了PCB行业的发展，同时对 PCB 板的制作和测试要求更高。
HDI board refers to the circuit board produced by high-density micro-wiring and tiny through-hole technology. It is a relatively new technology developed in the PCB industry at the end of the 20th century. Compared with traditional PCB, laser drilling technology (also known as laser board) is used to drill smaller holes, narrower lines and substantially reduced pads. More lines can be distributed within all unit area. High-density interconnection results from this, and the emergence of HDI technology ADAPTS to and promotes the development of PCB industry, and at the same time requires higher production and testing of PCB board.

二、HCT测试目的：
HCT Testing purposes:
HDI工艺PCB板HCT耐电流测试耐电流测试是测试印制电路板产品的孔互联可靠性的一种测试方法，目前各大厂商需要印制板供应商导入HCT测试。耐电流测试是在特殊设计的孔链上施加一定的直流电流，并持续一段时间，电流在孔链上产生焦耳热，热量传递到孔链附近基材上，基材受热膨胀产生Z方向膨胀应力导致盲孔断裂，从而检测出孔链的互联可靠性能。
Current resistance test is a test method to test the hole interconnection reliability of printed circuit board products. At present, various manufacturers need printed board suppliers to import HCT test. Current resistance test is to apply a certain DC current to a specially designed hole chain, and continue for a period of time. The current generates joule heat on the hole chain, and the heat is transferred to the base material near the hole chain. When the base material is heated, the expansion stress in the Z direction leads to the fracture of the blind hole, so as to detect the reliable interconnection performance of the hole chain.

三、仪器精度以及参数：
1.直流电源供应器
1.1 输出范围： 0-60V、0-10A、大于600W
1.2测量精确度
1.2.1 电压： 1% +10mV
1.2.2电流： 1% +10mA
2.温度测试仪
2.1 分度号：热电偶：K型
2.2 基本准确度：±0.2℃±6
2.3 测试范围：0℃~300℃（K型）
2.4 分辨率：0.1℃
2.5 热电偶准确度：±1.5℃
3.设备规格：
3.1 精密可编程电源供应器0-60V、0-10A、600W，RS232通信接口
3.2 K型热电偶多通道温度记录仪，RS232接口
3.3 工业电脑研华610L，19寸显示器
3.4 测试台及测试夹具